High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without primer.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing by casting, impregnation, and filament winding.
Good chemical resistance to alkalis, diluted acids, and solvents after full cure.
Low volatile organic compound (VOC) content, supporting compliance with industrial environmental safety standards.
Electrical insulation systems for medium-voltage transformers and dry-type reactors.
Structural adhesive formulations for aerospace composite bonding and repair.
Matrix resin for carbon fiber reinforced polymer (CFRP) wind turbine blade components.
Casting and encapsulation of high-reliability power electronics modules.
Potting compound for automotive sensors and EV battery module protection.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gels or sediment |
| Epoxy Equivalent Weight (EEW) | 178–186 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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