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High thermal stability with glass transition temperature (Tg) exceeding 175 °C after full curing.
Excellent chemical resistance to acids, alkalis, and solvents in harsh industrial environments.
Low ionic impurity content, ensuring high electrical insulation performance and reliability in electronic encapsulation.
Optimized molecular weight distribution for superior processability in transfer molding and casting applications.
Consistent batch-to-batch reproducibility meeting stringent semiconductor-grade quality control standards.
Encapsulation of integrated circuits (ICs) and power semiconductor devices.
Underfill materials for flip-chip and advanced packaging assemblies.
Matrix resin in high-reliability printed circuit board (PCB) laminates and prepregs.
Structural adhesives for aerospace and automotive electronics requiring extended service life at elevated temperatures.
| Chemical Type | Cresol-formaldehyde novolac epoxy resin |
| Product Form | Pale yellow to light amber solid pellets |
| Appearance | Free-flowing, uniform granules without visible impurities |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Softening Point | 82–88 °C |
| Volatiles Content | ≤ 0.3 wt% |
| Chloride Ion Content | ≤ 200 ppm |
| Key Features | High crosslink density, low moisture absorption, excellent dielectric strength |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
