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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and volume resistivity (>1 × 10¹³ Ω·cm).
Good chemical resistance to weak acids, alkalis, and aliphatic solvents after full cure.
Electrical encapsulation of transformers, reactors, and medium-voltage insulators.
Structural bonding in wind turbine blade assembly and aerospace composite components.
High-performance potting compounds for power electronics and EV battery modules.
Matrix resin for glass-fiber reinforced laminates used in marine and industrial tanks.
Tooling and mold-making resins requiring dimensional stability and low exotherm.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
