High reactivity with amine and anhydride hardeners for rapid gelation and reduced cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior thermal stability with glass transition temperature (Tg) up to 135°C after full cure.
Low chloride content (< 800 ppm) ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of power modules and IGBT substrates.
Structural adhesive formulation for automotive composite bonding.
Matrix resin in filament-wound pressure vessels and CFRP tanks.
High-performance potting compound for aerospace sensors and avionics housings.
Prepreg impregnation for carbon fiber laminates requiring low-void, high-Tg performance.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, amber-colored liquid |
| Appearance | Homogeneous, transparent, free from suspended particles |
| Epoxy Equivalent Weight (EEW) | 178–184 g/eq |
| Viscosity (25°C) | 12,000–14,000 mPa·s |
| Chloride Content | < 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China