Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Arakawa MODEPICS 504 Modified Epoxy Resin

Arakawa MODEPICS 504 is a high-performance modified epoxy resin from Arakawa Chemical’s MODEPICS series offering superior adhesion thermal stability and low viscosity for advanced composites coatings and electronic encapsulation applications.
  • arakawa modepics 504 modified epoxy resin_7ff1158b
  • arakawa modepics 504 modified epoxy resin_7ff1158b

Features Of Arakawa MODEPICS 504 Modified Epoxy Resin

  1. Enhanced flexibility and impact resistance compared to standard bisphenol-A epoxy resins.

  2. Improved adhesion to metals, composites, and low-surface-energy substrates.

  3. Reduced internal stress and excellent thermal shock resistance after curing.

  4. Good compatibility with common amine and anhydride hardeners for tailored cure profiles.

  5. Low viscosity at ambient temperature, enabling easy processing via casting, impregnation, or coating.

Typical Applications Of Arakawa MODEPICS 504 Modified Epoxy Resin

  1. High-reliability encapsulants for power electronics and IGBT modules.

  2. Structural adhesives in aerospace and automotive composite bonding.

  3. Electrically insulating potting compounds for sensors and high-voltage components.

  4. Matrix resin for carbon fiber prepregs requiring toughness and dimensional stability.

  5. Protective coatings for corrosion-resistant industrial flooring and chemical tank linings.

Specifications Of Arakawa MODEPICS 504 Modified Epoxy Resin

Chemical TypeModified bisphenol-A epoxy resin (flexibilized)
Product FormLiquid
AppearanceClear to pale amber, transparent liquid
Epoxy Equivalent Weight (EEW)180–195 g/eq
Viscosity (25°C)8,000–12,000 mPa·s
Softening PointNot applicable (liquid at room temperature)
Key FeaturesFlexibility enhancement, low shrinkage, high Tg potential with proper cure
Primary ApplicationsEncapsulation, structural bonding, potting, composite matrix


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