Enhanced flexibility and impact resistance compared to standard bisphenol-A epoxy resins.
Improved adhesion to metals, composites, and low-surface-energy substrates.
Reduced internal stress and excellent thermal shock resistance after curing.
Good compatibility with common amine and anhydride hardeners for tailored cure profiles.
Low viscosity at ambient temperature, enabling easy processing via casting, impregnation, or coating.
High-reliability encapsulants for power electronics and IGBT modules.
Structural adhesives in aerospace and automotive composite bonding.
Electrically insulating potting compounds for sensors and high-voltage components.
Matrix resin for carbon fiber prepregs requiring toughness and dimensional stability.
Protective coatings for corrosion-resistant industrial flooring and chemical tank linings.
| Chemical Type | Modified bisphenol-A epoxy resin (flexibilized) |
| Product Form | Liquid |
| Appearance | Clear to pale amber, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 180–195 g/eq |
| Viscosity (25°C) | 8,000–12,000 mPa·s |
| Softening Point | Not applicable (liquid at room temperature) |
| Key Features | Flexibility enhancement, low shrinkage, high Tg potential with proper cure |
| Primary Applications | Encapsulation, structural bonding, potting, composite matrix |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China