English
Español
tiếng việt
русский
Low viscosity for excellent processability and easy handling in casting, potting, and impregnation operations.
High purity with minimal volatile organic compounds (VOCs), supporting compliance with industrial safety and environmental standards.
Optimized reactivity profile enabling controlled cure kinetics with standard amine or anhydride hardeners.
Superior electrical insulation properties, including high dielectric strength and volume resistivity.
Excellent adhesion to metals, composites, and cured polymer substrates without primer requirement.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace and automotive composite bonding.
Matrix resin for filament-wound pressure vessels and fiber-reinforced piping systems.
Dielectric coatings and protective linings for electronic enclosures and PCB underfills.
Tooling resins for precision molds used in composite manufacturing and prototyping.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
