English
Español
tiếng việt
русский
High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring aggressive surface preparation.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and bubble-free casting.
Superior electrical insulation properties with high dielectric strength (>18 kV/mm) and volume resistivity (>1 × 10¹³ Ω·cm).
Good thermal stability with glass transition temperature (Tg) of 120–125°C after full cure with DDS.
Electrical encapsulation and potting of transformers, reactors, and medium-voltage switchgear components.
Structural bonding in wind turbine blade assembly and aerospace composite joints.
High-performance laminating resin for FR-4 and specialty printed circuit board (PCB) substrates.
Casting and molding of high-voltage insulators and bushings for power transmission equipment.
Matrix resin in carbon fiber reinforced polymer (CFRP) tooling and mold-making applications.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, free from gels or suspended particles |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
