High reactivity with amine and anhydride hardeners, enabling rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and treated plastics without requiring aggressive surface priming.
Low viscosity (8,000–12,000 cP at 25°C) for superior flow, wetting, and void-free impregnation in fiber-reinforced systems.
Good thermal stability with glass transition temperature (Tg) up to 165°C post-cure using standard diamine formulations.
Low chloride content (<500 ppm), ensuring high electrical insulation performance and corrosion resistance in electronic encapsulants.
Electrical potting and encapsulation of power modules, transformers, and high-voltage sensors.
Structural adhesive formulation for aerospace composite bonding and automotive lightweight assemblies.
Matrix resin for carbon fiber and fiberglass prepregs used in wind turbine blades and sporting goods.
Coating binder for corrosion-resistant industrial linings and tank interior protection.
Underfill material for flip-chip and advanced semiconductor packaging requiring low stress and CTE control.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, free from gels or particulates |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | <500 ppm |
| Softening Point | 12–18°C |
| Storage Stability | 12 months at <25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China