High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents.
Low viscosity (11,000–13,000 cP at 25°C) enabling easy processing and improved wetting of fillers/fibers.
Superior electrical insulation properties and low dielectric loss at elevated frequencies.
Good thermal stability with glass transition temperature (Tg) of cured system up to 160°C after post-cure.
Electrical encapsulation and potting compounds for power electronics and transformers.
High-performance laminating resins for FR-4 grade printed circuit board (PCB) substrates.
Structural adhesives requiring high bond strength and environmental resistance.
Composite matrix resin for aerospace and wind turbine blade components.
Insulating varnishes and coil coatings for electric motors and generators.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, amber-colored low-viscosity liquid |
| Appearance | Transparent, slightly viscous liquid at room temperature |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 11,000–13,000 cP |
| Chloride Content | ≤ 700 ppm |
| Softening Point | 12–15°C |
| Storage Stability | Stable for ≥12 months at 20–25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China