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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior chemical resistance to alkalis, solvents, and diluted acids after full cure.
Consistent batch-to-batch performance with tight control on epoxide equivalent weight (EEW) and color.
Structural adhesive formulations for aerospace and automotive bonding.
Matrix resin for carbon fiber and glass fiber reinforced composites.
Electrical encapsulation and potting compounds for high-voltage components.
High-performance coatings for corrosion protection of offshore and industrial steel structures.
Tooling resins for master models and low-volume production molds.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, amber-colored low-viscosity liquid |
| Appearance | Transparent, slightly viscous liquid at 25°C |
| Epoxide Equivalent Weight (EEW) | 180–188 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 750 ppm |
| Color (Gardner Scale) | ≤ 3 |
| Volatiles Content | ≤ 0.3 wt% |
Q1: What is the primary function of GESR904 in epoxy formulations?
A: GESR904 is a reactive diluent designed to reduce viscosity and improve processability of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising crosslink density or thermal performance.
Q2: Is GESR904 suitable for high-gloss, low-VOC coatings applications?
A: Yes — as a mono-functional reactive diluent, GESR904 contributes to lower VOC content and supports excellent flow and leveling in decorative and protective coating systems, while maintaining good film integrity after cure.
Q3: How does GESR904 affect pot life and cure kinetics?
A: GESR904 typically extends working time slightly compared to non-diluted resin systems, but does not act as a retardant — full cure profiles remain compatible with conventional amine or anhydride hardeners under standard thermal conditions.
Q4: Can GESR904 be used in electrical encapsulation or casting compounds?
A: It is commonly incorporated at low concentrations in medium- to high-voltage encapsulation formulations to aid air release and reduce exotherm, though final suitability depends on the full formulation’s dielectric requirements and thermal aging performance.
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