High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior chemical resistance to alkalis, solvents, and diluted acids after full cure.
Consistent batch-to-batch performance with tight control on epoxide equivalent weight (EEW) and color.
Structural adhesive formulations for aerospace and automotive bonding.
Matrix resin for carbon fiber and glass fiber reinforced composites.
Electrical encapsulation and potting compounds for high-voltage components.
High-performance coatings for corrosion protection of offshore and industrial steel structures.
Tooling resins for master models and low-volume production molds.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, amber-colored low-viscosity liquid |
| Appearance | Transparent, slightly viscous liquid at 25°C |
| Epoxide Equivalent Weight (EEW) | 180–188 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 750 ppm |
| Color (Gardner Scale) | ≤ 3 |
| Volatiles Content | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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