High reactivity with standard amine and anhydride hardeners for rapid cure kinetics.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing and impregnation.
Superior thermal stability with glass transition temperature (Tg) up to 180°C post-cure.
Low chloride content (<0.05%) ensuring corrosion resistance in demanding environments.
Aerospace composite laminates and prepregs.
High-voltage electrical insulation systems and encapsulants.
Wind turbine blade structural adhesives and matrix resins.
Automotive under-hood components requiring thermal and chemical resistance.
Industrial tooling and mold-making for precision carbon fiber parts.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to colorless, transparent liquid |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | <0.05 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at <25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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