Standard liquid bisphenol-A epoxy resin with consistent molecular weight distribution.
Excellent compatibility with common amine and anhydride curing agents.
Good adhesion to metals, composites, and various substrates.
High reactivity enabling efficient processing in casting, potting, and laminating applications.
Proven thermal and chemical resistance after proper cure.
Electrical encapsulation and potting of transformers, capacitors, and sensors.
Structural adhesives for aerospace and automotive bonding.
Laminating resin for fiberglass-reinforced plastic (FRP) panels and printed circuit boards (PCBs).
Casting compounds for industrial tooling and decorative art components.
| Chemical Type | Bisphenol-A based diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, low-viscosity liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 1,000 ppm |
| Softening Point | 12–18°C |
| Primary Applications | Encapsulation, laminating, adhesive formulation, and composite matrix resins |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China