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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and engineered plastics without surface pretreatment.
Low viscosity (350–450 mPa·s at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior thermal stability with glass transition temperature (Tg) exceeding 125°C after full cure.
Low chloride content (< 800 ppm), ensuring high electrical insulation performance and corrosion resistance.
Electrical encapsulation of power modules, IGBTs, and high-voltage sensors.
Structural adhesive formulations for aerospace composite bonding and repair.
High-performance potting compounds in automotive electronics and EV battery systems.
Prepreg matrix resin for carbon fiber laminates requiring fast cure and dimensional stability.
Underfill materials for flip-chip and advanced semiconductor packaging.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Liquid resin |
| Appearance | Clear, pale yellow to amber viscous liquid |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 350–450 mPa·s |
| Chloride Content | < 800 ppm |
| Volatiles Content | < 0.3 wt% |
| Storage Stability (25°C) | ≥ 12 months in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
