Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

CCP FUJICURE FXR-1081 Epoxy Resin

CCP FUJICURE FXR-1081 Epoxy Resin is a high-performance, low-viscosity cycloaliphatic epoxy resin from CCP’s FUJICURE series, engineered for UV/thermal dual-cure systems. It offers exceptional clarity, rapid cure speed, superior adhesion, and outstanding chemical/heat resistance—ideal for advanced electronics encapsulation, optical coatings, and precision molding applications requiring reliability and dimensional stability.
  • ccp fujicure fxr 1081 epoxy resin_7d6ace9a
  • ccp fujicure fxr 1081 epoxy resin_7d6ace9a

Features Of CCP FUJICURE FXR-1081 Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and engineered plastics without surface pretreatment.

  3. Low viscosity (350–450 mPa·s at 25°C) enabling easy processing, impregnation, and void-free casting.

  4. Superior thermal stability with glass transition temperature (Tg) exceeding 125°C after full cure.

  5. Low chloride content (< 800 ppm), ensuring high electrical insulation performance and corrosion resistance.

Typical Applications Of CCP FUJICURE FXR-1081 Epoxy Resin

  1. Electrical encapsulation of power modules, IGBTs, and high-voltage sensors.

  2. Structural adhesive formulations for aerospace composite bonding and repair.

  3. High-performance potting compounds in automotive electronics and EV battery systems.

  4. Prepreg matrix resin for carbon fiber laminates requiring fast cure and dimensional stability.

  5. Underfill materials for flip-chip and advanced semiconductor packaging.

Specifications Of CCP FUJICURE FXR-1081 Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-F (DGEBF)
Product FormLiquid resin
AppearanceClear, pale yellow to amber viscous liquid
Epoxy Equivalent Weight (EEW)165–175 g/eq
Viscosity (25°C)350–450 mPa·s
Chloride Content< 800 ppm
Volatiles Content< 0.3 wt%
Storage Stability (25°C)≥ 12 months in sealed container


CCP FUJICURE FXR-1081 Epoxy Resin – Frequently Asked Questions (FAQ)

Q1: What is the primary function of CCP FUJICURE FXR-1081 in epoxy formulations?

A: FXR-1081 is a reactive diluent and co-resin designed to reduce viscosity, improve processability, and enhance flexibility and impact resistance in cured epoxy systems—without significantly compromising thermal stability or chemical resistance.


Q2: Is FXR-1081 compatible with standard amine and anhydride curing agents?

A: Yes, FXR-1081 exhibits broad compatibility with common aliphatic and aromatic amines, as well as cyclic anhydrides. Its epoxy functionality allows for full incorporation into the crosslinking network, supporting consistent cure kinetics and final property development.


Q3: How does FXR-1081 compare to conventional glycidyl ether diluents in terms of volatility and handling safety?

A: FXR-1081 is a low-volatility, non-hazardous liquid under typical storage and processing conditions. Unlike many mono-functional glycidyl ethers, it poses minimal inhalation risk and reduced skin sensitization potential—making it suitable for industrial environments where operator exposure control is prioritized.


Q4: Can FXR-1081 be used in food-contact or potable water applications?

A: FXR-1081 is not pre-qualified for direct food-contact or potable water applications. Formulators must conduct full regulatory evaluation—including migration testing and compliance verification—based on the final cured system’s intended use and applicable regional requirements.



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