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Highly versatile bisphenol-A based liquid epoxy resin with excellent reactivity toward amine and anhydride curing agents.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy handling, mixing, and impregnation into fibrous reinforcements.
Superior mechanical strength and chemical resistance after full cure, particularly against alkalis and solvents.
Consistent batch-to-batch quality with low chloride content (< 500 ppm), ensuring reliability in high-performance composites.
Optimized for ambient and elevated temperature curing systems, supporting flexible processing across manufacturing lines.
Fiber-reinforced polymer (FRP) composites for wind turbine blades and structural profiles.
Electrical laminates and printed circuit board (PCB) prepregs requiring dimensional stability and dielectric integrity.
High-performance adhesives for aerospace and automotive bonding applications.
Protective coatings for industrial flooring, marine structures, and chemical storage tanks.
Potting and encapsulation compounds for electronic components and sensors.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | 12–16°C |
| Volatiles (150°C, 2 hrs) | < 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
