High purity bisphenol-A based solid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatile organic compound (VOC) content for safer processing.
Superior compatibility with common curing agents including amines, anhydrides, and phenolic resins.
Low melt viscosity enabling smooth melt blending and uniform dispersion in composite formulations.
Outstanding electrical insulation properties and moisture resistance after full cure.
Electrical encapsulation and potting compounds for transformers, reactors, and high-voltage insulators.
Structural adhesives for aerospace and automotive composite bonding.
Prepregs and filament-wound composites requiring high glass transition temperature (Tg) and dimensional stability.
Powder coatings for metal substrates demanding corrosion resistance and mechanical durability.
High-performance laminates in printed circuit board (PCB) base materials.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Pale yellow to amber solid flakes or pellets |
| Appearance | Free-flowing, homogeneous solid with no visible impurities |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq |
| Melting Point | 85–92 °C |
| Softening Point (Ring & Ball) | 82–88 °C |
| Gardner Color | ≤ 2 |
| Volatiles Content (150 °C, 2 h) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China