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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring primers.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of 125–135°C after full cure with DDS hardener.
Electrical insulation systems for medium- and high-voltage transformers and reactors.
Encapsulation and potting of power electronics, including IGBT modules and EV inverters.
Structural laminating resin for fiber-reinforced polymer (FRP) components in energy infrastructure.
Core material in vacuum-pressure impregnation (VPI) processes for rotating machine windings.
Matrix resin for high-performance composite tooling and aerospace-grade mandrels.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in unopened original container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
