High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility during processing.
Superior adhesion to metals, glass, and composite substrates.
Low viscosity at elevated temperatures, enabling efficient impregnation and coating.
Compatible with standard amine and anhydride curing agents for versatile formulation flexibility.
Electrical insulation systems for motors, transformers, and generators.
Structural composites in wind turbine blades and aerospace components.
High-performance protective coatings for marine and industrial infrastructure.
Adhesives for automotive bonding and electronic encapsulation.
Potting and encapsulation compounds for power electronics and LED modules.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, homogeneous liquid without visible particles or gel |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Electrical insulation, composites, protective coatings, adhesives, potting |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China