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High reactivity with amine and anhydride hardeners for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured concrete substrates.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing and air release in casting and impregnation.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural bonding in wind turbine blade assembly and aerospace composite components.
Castings for industrial tooling, jigs, and precision molds requiring dimensional stability.
Impregnation of dry-type power transformers and resin-rich laminates.
Underfill and potting formulations for power electronics and EV battery modules.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 172–178 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at 20–25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
