Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Hexion HELOXY 505 Waterborne Epoxy Resin

Hexion HELOXY 505 Waterborne Epoxy Resin is a low-VOC, anionic, self-emulsifying epoxy dispersion designed for high-performance water-based coatings and adhesives. It offers excellent chemical resistance, adhesion to metals and concrete, and enables fast ambient-cure formulations without co-solvents. Ideal for industrial maintenance, flooring, and protective coatings where sustainability and performance intersect.
  • hexion heloxy 505 waterborne epoxy resin_07db177d
  • hexion heloxy 505 waterborne epoxy resin_07db177d

Features Of Hexion HELOXY 505 Waterborne Epoxy Resin

  1. Low-VOC, waterborne formulation compliant with stringent environmental regulations.

  2. Excellent hydrolytic stability and shelf life in aqueous dispersion.

  3. Good compatibility with amine-based curing agents for ambient or heat-cure systems.

  4. Enables high-gloss, durable films with strong adhesion to metals and concrete substrates.

  5. Reduced odor and improved workplace safety compared to solvent-borne epoxy resins.

Typical Applications Of Hexion HELOXY 505 Waterborne Epoxy Resin

  1. Waterborne industrial maintenance coatings for steel structures and pipelines.

  2. Concrete floor coatings requiring low-emission, high-durability performance.

  3. Primers for automotive and agricultural equipment OEM and refinish applications.

  4. High-performance can and coil coatings where regulatory compliance is critical.

Specifications Of Hexion HELOXY 505 Waterborne Epoxy Resin

Chemical TypeWaterborne bisphenol-A based epoxy dispersion
Product FormOff-white to light yellow aqueous dispersion
AppearanceOpaque liquid, homogeneous without sedimentation
Non-Volatile Content (wt%)48–52%
pH (at 25°C)7.0–8.5
Viscosity (mPa·s, Brookfield RVT, #3 spindle, 20 rpm)200–600
Density (g/cm³ at 25°C)1.05–1.10
Particle Size (D50, nm)120–180


Hexion HELOXY 505 Waterborne Epoxy Resin – Frequently Asked Questions (FAQ)

Q1: What is the primary function of HELOXY 505 in waterborne epoxy systems?

A: HELOXY 505 serves as a reactive diluent and viscosity modifier, enabling improved handling and film formation while maintaining epoxy functionality in low-VOC, water-based formulations.


Q2: Can HELOXY 505 be used in direct-to-metal (DTM) coatings?

A: Yes — it is commonly incorporated into waterborne DTM epoxy primers and basecoats to enhance adhesion, corrosion resistance, and crosslink density without compromising water dispersibility.


Q3: How does HELOXY 505 compare to conventional glycidyl ether diluents in terms of water compatibility?

A: Unlike many hydrophobic glycidyl ethers, HELOXY 505 is specifically designed for waterborne systems, offering inherent colloidal stability and reduced risk of phase separation during emulsification or storage.


Q4: Is HELOXY 505 compatible with common amine-based waterborne curing agents?

A: Yes — it demonstrates good reactivity and compatibility with aliphatic and cycloaliphatic polyamine dispersions, supporting efficient ambient- or elevated-temperature cure profiles in two-component systems.



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