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High-purity bisphenol-F based epoxy resin with low chloride content for enhanced electrical insulation.
Excellent thermal stability and glass transition temperature (Tg) suitable for demanding curing profiles.
Low viscosity at elevated temperatures, enabling superior flow and impregnation in composites and encapsulants.
Outstanding chemical resistance to alkalis, solvents, and mild acids after full cure.
Consistent batch-to-batch performance certified under ISO 9001 manufacturing controls.
Electrical insulation systems for high-voltage transformers and bushings.
Encapsulation and potting compounds for power electronics and LED modules.
Structural adhesives in aerospace and automotive composite bonding.
Matrix resin for filament-wound pressure vessels and FRP tanks.
High-performance laminates in printed circuit board (PCB) substrates requiring low Dk/Df.
| Chemical Type | Bisphenol-F epoxy resin |
| Product Form | Light amber viscous liquid |
| Appearance | Clear, transparent, free from gel or sediment |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 800 ppm |
| Softening Point | 20–25°C |
| Storage Stability | 12 months at <30°C in sealed original container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
