High molecular weight solid epoxy resin with excellent thermal stability and low melt viscosity.
Outstanding chemical resistance, particularly to alkalis and solvents after full cure.
Provides superior mechanical strength and dimensional stability in cured thermoset systems.
Compatible with a broad range of curing agents including anhydrides, dicyandiamide, and aromatic amines.
Low volatile organic compound (VOC) content, supporting environmentally responsible formulation practices.
Electrical encapsulation and potting compounds for high-voltage insulators and transformers.
Structural adhesives requiring elevated temperature resistance and long-term durability.
Composite matrix resins for aerospace and wind energy blade components.
Powder coating binders for industrial metal finishing applications.
High-performance filament winding resins used in pressure vessels and piping systems.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Pale yellow to amber solid flakes or pellets |
| Appearance | Free-flowing, non-dusty solid |
| Epoxy Equivalent Weight (EEW) | 470–510 g/eq |
| Melting Point | 95–105 °C |
| Softening Point (Ring & Ball) | 85–95 °C |
| Volatiles Content (105 °C, 2 hrs) | < 0.3 wt% |
| Color (Gardner Scale) | < 4 |
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E-mail: wangxingqiang@ericwchem.com
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