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High reactivity with standard amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent chemical resistance to acids, alkalis, and solvents after full curing.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior adhesion to metals, composites, and cured polymer substrates.
Low volatile organic compound (VOC) content, compliant with industrial environmental safety guidelines.
Structural adhesive formulations for aerospace and automotive bonding.
Matrix resin for carbon fiber and glass fiber reinforced composites.
Electrical encapsulation and potting of high-voltage components and PCBs.
Protective coatings for offshore and industrial steel infrastructure.
Wind turbine blade manufacturing and repair systems.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Liquid epoxy resin |
| Appearance | Clear to pale yellow viscous liquid |
| Epoxy Equivalent Weight (EEW) | 170–178 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
Q1: What is the primary application of KUKDO SM-172X75 epoxy resin?
A: KUKDO SM-172X75 is a liquid bisphenol-A based epoxy resin primarily formulated for use in high-performance protective coatings, including marine and industrial maintenance systems, where excellent chemical resistance, adhesion to metal substrates, and durability under harsh environmental conditions are required.
Q2: Is SM-172X75 compatible with standard amine-based curing agents?
A: Yes, SM-172X75 exhibits good reactivity with conventional aliphatic, cycloaliphatic, and aromatic amine hardeners. Its viscosity and epoxide equivalent weight are optimized to support balanced pot life and cure performance across common formulation systems.
Q3: How should SM-172X75 be stored to maintain stability?
A: Store in original sealed containers at temperatures between 10°C and 30°C, away from direct sunlight and moisture. Prolonged exposure to freezing conditions or excessive heat may affect viscosity and handling properties; allow material to equilibrate to ambient temperature before use.
Q4: Can SM-172X75 be used in solvent-free or low-VOC formulations?
A: Yes — its relatively low viscosity and high epoxide content make it well-suited for solvent-free or reduced-solvent coating and adhesive systems, supporting compliance with evolving VOC regulations without requiring extensive dilution.
Q5: Does SM-172X75 require post-cure for optimal performance?
A: Post-cure is not strictly required for basic functionality, but elevated temperature curing (e.g., 60–80°C for several hours) can enhance crosslink density, improving hardness, chemical resistance, and long-term thermal stability in demanding applications.
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