High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high volume resistivity (>1 × 10¹³ Ω·cm) and low dielectric loss.
Good thermal stability with glass transition temperature (Tg) of 125–135°C after post-cure.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Matrix resin for fiber-reinforced composites in wind turbine blades and aerospace secondary structures.
Structural adhesive formulation for automotive bonding and metal-to-metal assembly.
Coating and lining systems for corrosion-resistant tanks and chemical process equipment.
Prepreg production for printed circuit board (PCB) laminates and high-frequency substrate materials.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 700 ppm |
| Volatile Content | ≤ 0.3 wt% |
| Primary Applications | Encapsulation, composites, adhesives, coatings |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China