High-purity solid bisphenol-A based epoxy resin with low ionic impurities.
Excellent thermal stability and consistent melt viscosity for precise processing control.
Low chlorine content ensuring superior electrical insulation properties.
Optimized for high-gloss, defect-free surface finish in casting and encapsulation.
Compatible with standard amine and anhydride curing agents for flexible formulation design.
High-voltage electrical insulation components (e.g., bushings, insulators).
Precision encapsulation of sensors and microelectronic modules.
Structural casting for aerospace tooling and composite mandrels.
Advanced wind turbine generator potting and stator encapsulation.
UV-stable decorative and industrial flooring systems requiring chemical resistance.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | White to off-white crystalline solid flakes |
| Appearance | Free-flowing granular solid at room temperature |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Melt Viscosity (150 °C) | 8,000–12,000 mPa·s |
| Softening Point | 82–86 °C |
| Chlorine Content | ≤ 700 ppm |
| Volatiles (125 °C, 2 h) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China