High-performance solid epoxy resin with excellent thermal stability and low volatility.
Outstanding chemical resistance to solvents, acids, and alkalis after full cure.
Low moisture absorption ensuring dimensional stability in humid or demanding environments.
Excellent electrical insulation properties suitable for high-voltage applications.
Designed for precise stoichiometric blending with compatible hardeners for consistent crosslink density.
High-voltage insulators and bushings in power transmission equipment.
Encapsulation and potting of sensitive electronic components and sensors.
Structural adhesives for aerospace composite bonding where thermal cycling resistance is critical.
Matrix resin in filament-wound pressure vessels and cryogenic tanks.
Electrical laminates and printed circuit board (PCB) prepregs requiring low dielectric loss.
| Chemical Type | Multi-functional solid epoxy resin (Diglycidyl ether of bisphenol-F derivative) |
| Product Form | Pale yellow to amber solid flakes or powder |
| Appearance | Free-flowing crystalline solid at room temperature |
| Epoxide Equivalent Weight (EEW) | 175–185 g/eq |
| Glass Transition Temperature (Tg) | ≥ 120 °C (post-cured with DICY) |
| Softening Point | 85–95 °C (DSC, ASTM E2161) |
| Volatility (Loss on Heating at 150 °C, 2 h) | < 0.5 wt% |
| Primary Applications | High-performance composites, electrical insulation, structural adhesives |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China