High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured thermosets—ideal for structural bonding applications.
Low viscosity (80–100 cP at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural adhesive formulation for aerospace and automotive composite assemblies.
Matrix resin in filament-wound pressure vessels and fiber-reinforced pipes.
Potting compound for power electronics, sensors, and LED modules requiring thermal and moisture resistance.
Tooling and mold-making resins for RTM and compression molding processes.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Transparent, homogeneous, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 470–490 g/eq |
| Viscosity (25°C) | 80–100 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, potting, structural adhesives, composite matrix |
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E-mail: wangxingqiang@ericwchem.com
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