Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SMB-500A-80 Epoxy Resin

KUKDO SMB-500A-80 Epoxy Resin is a high-performance liquid bisphenol-A epoxy resin offering excellent adhesion thermal stability and low viscosity for composites coatings and electronic encapsulation. Designed for demanding industrial applications it ensures reliable curing compatibility with standard hardeners and superior mechanical properties after polymerization.
  • kukdo smb 500a 80 epoxy resin_01e5699a
  • kukdo smb 500a 80 epoxy resin_01e5699a

Features Of KUKDO SMB-500A-80 Epoxy Resin

  1. High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and cured thermosets—ideal for structural bonding applications.

  3. Low viscosity (80–100 cP at 25°C) enabling easy processing, impregnation, and void-free casting.

  4. Superior electrical insulation properties with high dielectric strength and volume resistivity.

  5. Good thermal stability with glass transition temperature (Tg) up to 125°C after full cure.

Typical Applications Of KUKDO SMB-500A-80 Epoxy Resin

  1. Electrical encapsulation of transformers, reactors, and high-voltage insulators.

  2. Structural adhesive formulation for aerospace and automotive composite assemblies.

  3. Matrix resin in filament-wound pressure vessels and fiber-reinforced pipes.

  4. Potting compound for power electronics, sensors, and LED modules requiring thermal and moisture resistance.

  5. Tooling and mold-making resins for RTM and compression molding processes.

Specifications Of KUKDO SMB-500A-80 Epoxy Resin

Chemical TypeBisphenol-A based liquid epoxy resin
Product FormClear to pale yellow low-viscosity liquid
AppearanceTransparent, homogeneous, free from gels or sediment
Epoxy Equivalent Weight (EEW)470–490 g/eq
Viscosity (25°C)80–100 cP
Chloride Content≤ 500 ppm
Softening PointNot applicable (liquid at room temperature)
Primary ApplicationsEncapsulation, potting, structural adhesives, composite matrix


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