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High-performance solid epoxy resin offering excellent thermal stability and chemical resistance.
Low volatility and minimal outgassing, suitable for vacuum and high-reliability applications.
Excellent adhesion to metals, composites, and engineered plastics without primer.
Good mechanical strength retention after prolonged exposure to elevated temperatures.
Designed for solvent-free formulations and compatible with standard epoxy curing agents.
Aerospace structural adhesives and composite matrix resins.
Electronics encapsulation and underfill materials for high-temperature packaging.
Industrial tooling and mold-making where dimensional stability is critical.
High-voltage insulation systems in power transmission equipment.
Repair and bonding of turbine components exposed to thermal cycling.
| Chemical Type | Bisphenol-F based solid epoxy resin |
| Product Form | Pale yellow to amber solid flakes |
| Appearance | Free-flowing crystalline solid |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Melting Point | 85–92 °C |
| Softening Point (Ring & Ball) | 88–94 °C |
| Volatility (1 hr @ 150 °C) | < 0.5 wt% |
| Key Features | Low ionic impurities, high purity, consistent batch-to-batch performance |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
