High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with common amine and anhydride curing agents.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing and impregnation.
Superior electrical insulation properties and thermal stability up to 130°C.
Consistent batch-to-batch performance meeting ISO 9001 manufacturing standards.
Electrical potting and encapsulation for transformers, reactors, and insulators.
High-voltage composite insulator housing and core bonding.
Laminating resin for glass-fiber reinforced printed circuit board (PCB) substrates.
Structural adhesives in wind turbine blade assembly and automotive composites.
Coating formulations for corrosion-resistant industrial tank linings.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Softening Point | 12–15°C |
| Storage Stability | 12 months at <25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China