Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

CCP FUJICURE FXR-1030 Epoxy Resin

CCP FUJICURE FXR-1030 Epoxy Resin is a low-viscosity, fast-curing brominated epoxy resin from CCP’s FUJICURE series, engineered for high-performance encapsulation and electrical insulation. It delivers excellent flame retardancy (UL94 V-0), thermal stability, and adhesion to metals and plastics—ideal for LED packaging, power modules, and automotive electronics applications requiring rapid throughput and reliability.
  • ccp fujicure fxr 1030 epoxy resin_b7075d1b
  • ccp fujicure fxr 1030 epoxy resin_b7075d1b

Features Of CCP FUJICURE FXR-1030 Epoxy Resin

  1. High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.

  2. Excellent adhesion to metals, composites, and treated plastics without primer requirement.

  3. Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing by casting, impregnation, and resin transfer molding (RTM).

  4. Superior electrical insulation properties with high dielectric strength and volume resistivity.

  5. Good thermal stability with glass transition temperature (Tg) of 120–130°C after full cure with standard hardeners.

Typical Applications Of CCP FUJICURE FXR-1030 Epoxy Resin

  1. Electrical encapsulation and potting of transformers, reactors, and medium-voltage switchgear components.

  2. Structural bonding in wind turbine blade assembly and automotive composite parts.

  3. Matrix resin for filament-wound pressure vessels and aerospace-grade composite laminates.

  4. Insulating coatings and busbar encapsulation in power electronics and EV battery modules.

Specifications Of CCP FUJICURE FXR-1030 Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear, low-viscosity liquid
AppearanceColorless to pale yellow, transparent
Epoxy Equivalent Weight (EEW)175–185 g/eq
Viscosity (25°C)8,000–12,000 cP
Chlorine Content< 900 ppm
Softening PointNot applicable (liquid at room temperature)
Storage Stability12 months at 25°C in sealed original container


CCP FUJICURE FXR-1030 Epoxy Resin – Frequently Asked Questions (FAQ)

Q1: What is the primary function of FXR-1030 in epoxy formulations?

A: FXR-1030 is a reactive diluent and viscosity modifier designed to reduce the viscosity of standard bisphenol-A or bisphenol-F based epoxy resins without significantly compromising reactivity or final crosslink density. It enables improved processability—especially in casting, potting, and coating applications—while maintaining good thermal and mechanical performance in the cured network.


Q2: Is FXR-1030 compatible with common amine and anhydride curing agents?

A: Yes, FXR-1030 demonstrates broad compatibility with aliphatic and cycloaliphatic amines, as well as aromatic amines and anhydride hardeners. Its glycidyl ether structure ensures predictable reactivity and integration into the epoxy network during cure, supporting consistent gel time and full development of physical properties.


Q3: How does FXR-1030 compare to non-reactive diluents in terms of volatility and leaching risk?

A: Unlike non-reactive diluents, FXR-1030 participates covalently in the curing reaction, becoming an integral part of the polymer matrix. This eliminates concerns related to volatilization during processing or post-cure and minimizes potential for extractables or long-term leaching in demanding service environments.


Q4: What are typical handling and storage recommendations for FXR-1030?

A: FXR-1030 should be stored in tightly sealed containers under dry, cool conditions (preferably below 30 °C) and protected from moisture and direct sunlight. Prolonged exposure to humidity may lead to slight viscosity increase or cloudiness due to trace hydrolysis; however, this does not significantly impair functionality when used within recommended shelf life and proper formulation practices.



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