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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (8,000–12,000 cP at 25°C) enabling easy processing by casting, impregnation, and resin transfer molding (RTM).
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of 120–130°C after full cure with standard hardeners.
Electrical encapsulation and potting of transformers, reactors, and medium-voltage switchgear components.
Structural bonding in wind turbine blade assembly and automotive composite parts.
Matrix resin for filament-wound pressure vessels and aerospace-grade composite laminates.
Insulating coatings and busbar encapsulation in power electronics and EV battery modules.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 8,000–12,000 cP |
| Chlorine Content | < 900 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at 25°C in sealed original container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
