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Low-viscosity liquid formulation enabling excellent flow and air release during processing.
High purity with low ionic impurity content, ensuring superior electrical insulation performance.
Compatible with standard amine and anhydride curing agents for flexible formulation design.
Excellent adhesion to metals, glass, and composite substrates without primer requirement.
Good thermal stability with glass transition temperature (Tg) up to 120 °C post-cure.
Electrical encapsulation of transformers, reactors, and high-voltage sensors.
Potting compound for automotive electronic control units (ECUs) and power modules.
Matrix resin in filament-wound composite pressure vessels and structural components.
Adhesive system for bonding aerospace-grade aluminum and carbon fiber laminates.
Base resin for UV/thermal dual-cure coatings in precision optical and medical device assemblies.
| Chemical Type | Bisphenol-A based diglycidyl ether epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25 °C | 10,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25 °C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
