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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics under ambient and elevated temperature conditions.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing, impregnation, and flow control in casting and potting applications.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to weak acids, alkalis, and solvents after full cure.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace composite bonding and automotive component assembly.
Matrix resin for filament-wound pressure vessels and fiber-reinforced polymer (FRP) tanks.
Casting compound for precision tooling, jigs, and industrial molds requiring dimensional stability.
Base resin in high-performance powder coatings for corrosion-resistant metal finishing.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at <25°C in sealed original packaging |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
