High-purity imidazole-based latent curing agent specifically designed for epoxy resin systems.
Excellent storage stability at room temperature with extended pot life upon heating activation.
Promotes rapid and uniform cure at elevated temperatures (120–150 °C), enabling efficient industrial processing.
Delivers superior thermal resistance and mechanical strength in cured epoxy matrices.
Low volatility and minimal odor, supporting safer handling and improved workplace air quality.
Prepregs and laminates for high-performance printed circuit boards (PCBs).
Structural adhesives in aerospace and automotive composite bonding.
Encapsulants and potting compounds for power electronics and LED modules.
Carbon fiber reinforced polymer (CFRP) matrix resins for lightweight structural components.
Electrically insulating coatings for high-voltage equipment and busbars.
| Chemical Type | Imidazole derivative (2-methylimidazole adduct) |
| Product Form | White to off-white crystalline powder |
| Appearance | Free-flowing fine crystalline solid |
| Melting Point | Approx. 110–115 °C (determined by DSC) |
| Active Ingredient Content | ≥98.5% (by HPLC) |
| Moisture Content | ≤0.3% (by Karl Fischer titration) |
| Storage Stability | Stable ≥12 months at ≤25 °C in sealed container |
| Primary Applications | Latent curing agent for bisphenol-A/F and novolac epoxy resins |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China