High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing and impregnation.
Good thermal stability with glass transition temperature (Tg) up to 125°C after full cure.
Low chlorine content (<0.05%) ensuring high electrical insulation performance.
Electrical encapsulation and potting compounds for transformers and power modules.
Structural adhesives in automotive and aerospace composite bonding.
Prepreg matrix resin for carbon fiber reinforced laminates.
Insulating varnishes for motor and generator windings.
High-performance casting resins for industrial tooling and prototypes.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chlorine Content | ≤ 0.05 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China