Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

CCP BE501X75 Bisphenol A Epoxy Resin

CCP BE501X75 is a high-purity Bisphenol A epoxy resin from CCP’s BE series, offering excellent adhesion, chemical resistance and thermal stability. Widely used in composites, coatings and electronic encapsulation, it delivers consistent reactivity and low viscosity for optimized processing. Trusted for reliability in demanding industrial applications.
  • ccp be501x75 bisphenol a epoxy resin_b4945c2a
  • ccp be501x75 bisphenol a epoxy resin_b4945c2a

Features Of CCP BE501X75 Bisphenol A Epoxy Resin

  1. High purity Bisphenol A-based epoxy resin with consistent molecular weight distribution.

  2. Optimized for excellent adhesion to metals, composites, and cured polymer substrates.

  3. Low viscosity at elevated processing temperatures, enabling efficient impregnation and coating.

  4. Superior chemical resistance to alkalis, dilute acids, and common solvents after full cure.

  5. Compatible with standard amine and anhydride curing agents for flexible formulation design.

Typical Applications Of CCP BE501X75 Bisphenol A Epoxy Resin

  1. Structural adhesives for aerospace and automotive bonding applications.

  2. Matrix resin in fiber-reinforced composites for wind turbine blades and industrial components.

  3. Electrical encapsulation and potting compounds for power electronics and transformers.

  4. High-performance protective coatings for marine and offshore infrastructure.

  5. Prepreg systems requiring precise resin flow control and low void content.

Specifications Of CCP BE501X75 Bisphenol A Epoxy Resin

Chemical TypeBisphenol A diglycidyl ether (DGEBA) epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceHomogeneous, transparent, free of gel particles or sediment
Epoxy Equivalent Weight (EEW)185–192 g/eq
Viscosity at 125°C1,200–1,600 cP
Chloride Content≤ 500 ppm
Volatiles Content≤ 0.3 wt%
Storage StabilityStable for ≥12 months at 25°C in sealed containers


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