High purity Bisphenol A-based epoxy resin with consistent molecular weight distribution.
Optimized for excellent adhesion to metals, composites, and cured polymer substrates.
Low viscosity at elevated processing temperatures, enabling efficient impregnation and coating.
Superior chemical resistance to alkalis, dilute acids, and common solvents after full cure.
Compatible with standard amine and anhydride curing agents for flexible formulation design.
Structural adhesives for aerospace and automotive bonding applications.
Matrix resin in fiber-reinforced composites for wind turbine blades and industrial components.
Electrical encapsulation and potting compounds for power electronics and transformers.
High-performance protective coatings for marine and offshore infrastructure.
Prepreg systems requiring precise resin flow control and low void content.
| Chemical Type | Bisphenol A diglycidyl ether (DGEBA) epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 125°C | 1,200–1,600 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | Stable for ≥12 months at 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China