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High-purity bisphenol-A based epoxy resin with low ionic impurities for enhanced electrical insulation performance.
Optimized molecular weight distribution ensuring excellent flow control and reduced gel time in casting and potting formulations.
Superior thermal stability with glass transition temperature (Tg) up to 120 °C after full cure with standard amine hardeners.
Low viscosity (11,000–13,000 cP at 25 °C) enabling easy processing, degassing, and deep-section encapsulation.
Excellent adhesion to metals, ceramics, and reinforced plastics without mandatory surface priming.
High-voltage electrical insulation systems for transformers and bushings.
Potting and encapsulation of power electronics modules including IGBTs and EV inverters.
Casting of dry-type instrument transformers and current/voltage sensors.
Structural bonding and composite matrix resin in aerospace-grade laminates.
Underfill and glob-top protection for high-reliability semiconductor packages.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Amber to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25 °C) | 11,000–13,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability (25 °C) | ≥ 12 months in sealed container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
