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High reactivity with amine and anhydride hardeners, enabling fast cure cycles in industrial manufacturing.
Excellent mechanical strength and thermal stability post-cure, supporting demanding structural applications.
Low viscosity at room temperature, facilitating easy processing, impregnation, and uniform coating without solvent dilution.
Superior electrical insulation properties, including high dielectric strength and volume resistivity.
Good adhesion to diverse substrates such as metals, fiberglass, and cured composites.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesives for aerospace and automotive composite bonding.
Matrix resin in filament-wound pressure vessels and FRP tanks.
High-performance laminating resin for printed circuit board (PCB) prepregs and base materials.
Tooling and mold-making compounds requiring dimensional stability and low shrinkage.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 182–188 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 1,000 ppm |
| Softening Point | 12–16°C |
| Primary Applications | Electrical insulation, structural composites, high-performance adhesives |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
