High purity bisphenol-A based liquid epoxy resin with low chloride content.
Excellent thermal stability and consistent reactivity for reliable curing performance.
Low viscosity enabling easy handling, mixing, and impregnation in composite processes.
Superior adhesion to metals, glass fibers, and carbon substrates.
Complies with RoHS and REACH regulatory requirements for industrial use.
Electrical insulation systems for transformers and busbars.
Structural adhesives in automotive and aerospace assembly.
Matrix resin for filament-wound composites and pultruded profiles.
Encapsulation and potting compounds for electronic components.
Coating formulations for corrosion-resistant protective linings.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 750 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Composite matrices, electrical encapsulation, structural adhesives |
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E-mail: wangxingqiang@ericwchem.com
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