Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO SM828 Epoxy Resin

KUKDO SM828 Epoxy Resin is a high-performance bisphenol-A based liquid epoxy resin from KUKDO’s SM series, offering excellent mechanical strength, adhesion, and chemical resistance. Widely used in composites, coatings, and electrical encapsulation, it features low viscosity, good reactivity with amines/anhydrides, and superior thermal stability. Ideal for demanding industrial applications requiring reliability and consistency.
  • kukdo sm828 epoxy resin_8ebe448e
  • kukdo sm828 epoxy resin_8ebe448e

Features Of KUKDO SM828 Epoxy Resin

  1. High-performance bisphenol-A based liquid epoxy resin with excellent mechanical strength and chemical resistance.

  2. Low viscosity for superior processability in casting, impregnation, and laminating applications.

  3. Consistent reactivity profile ensuring reliable cure behavior with standard amine and anhydride hardeners.

  4. Low volatile organic compound (VOC) content, supporting environmentally responsible manufacturing practices.

  5. Excellent adhesion to metals, composites, and cured polymer substrates across diverse temperature ranges.

Typical Applications Of KUKDO SM828 Epoxy Resin

  1. Electrical insulation systems for transformers, reactors, and high-voltage bushings.

  2. Structural adhesive formulations in aerospace and automotive composite bonding.

  3. Encapsulation and potting of sensitive electronic components and power modules.

  4. Reinforced thermoset composites for wind turbine blades and marine structural parts.

  5. High-durability flooring and protective coatings for industrial concrete surfaces.

Specifications Of KUKDO SM828 Epoxy Resin

Chemical TypeBisphenol-A epoxy resin
Product FormClear to pale yellow liquid
AppearanceHomogeneous, low-viscosity liquid, free from gels or sediment
Epoxy Equivalent Weight (EEW)185–192 g/eq
Viscosity at 25°C12,000–16,000 cP
Chloride Content≤ 500 ppm
Volatiles Content≤ 0.3 wt%
Storage Stability≥ 12 months at ≤ 25°C in unopened original packaging


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