High purity bisphenol-A based liquid epoxy resin with consistent epoxide equivalent weight (EEW) for reliable curing performance.
Low viscosity (10,000–12,000 cP at 25°C) enabling excellent flow, wetting, and ease of processing in casting and impregnation applications.
Excellent thermal stability and chemical resistance, particularly to alkalis and diluted acids after full cure.
Low volatile organic compound (VOC) content, meeting stringent environmental and occupational health requirements for industrial use.
Compatible with a wide range of amine, anhydride, and phenolic hardeners for tailored cure profiles and mechanical properties.
Electrical insulation systems for dry-type transformers and reactors.
Structural adhesives in automotive and aerospace composite bonding.
Encapsulation and potting compounds for power electronics and LED modules.
Reinforced thermoset composites in wind turbine blade manufacturing.
High-performance coatings for corrosion protection in marine and industrial infrastructure.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Colorless to pale yellow, transparent |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | 12–15°C |
| Storage Stability | ≥ 12 months at <25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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