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Low-viscosity liquid epoxy resin enabling excellent flow and wetting in demanding formulations.
High purity with low chloride content, supporting reliable electrical insulation performance.
Compatible with a broad range of amine and anhydride curing agents for flexible formulation design.
Consistent reactivity and shelf stability under recommended storage conditions.
Designed for low volatile organic compound (VOC) emissions in compliant industrial applications.
Electrical encapsulation and potting compounds for transformers, sensors, and power electronics.
High-performance laminating resins for printed circuit board (PCB) prepregs and copper-clad laminates.
Structural adhesives requiring thermal stability and chemical resistance in aerospace and automotive assemblies.
Composite matrix resins for filament-wound pressure vessels and wind blade components.
Protective coatings for corrosion-resistant industrial flooring and marine infrastructure.
| Chemical Type | Diglycidyl ether of bisphenol-A (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity at 25°C | 12,000–16,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, laminates, adhesives, composites, protective coatings |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
