Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

YD-115E Epoxy Resin

YD-115E Epoxy Resin is a high-performance bisphenol-A-based epoxy resin from Yada’s YD series, offering excellent adhesion, chemical resistance and mechanical strength. Widely used in composites, coatings and electronic encapsulation, it features low viscosity, good flowability and reliable curing compatibility with common hardeners.
  • yd 115e epoxy resin_70d7e36a
  • yd 115e epoxy resin_70d7e36a

Features Of YD-115E Epoxy Resin

  1. High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.

  2. Excellent adhesion to metals, glass, and composite substrates under ambient and elevated cure conditions.

  3. Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, mixing, and impregnation.

  4. Superior electrical insulation properties and low dielectric loss at high frequencies.

  5. Good chemical resistance to dilute acids, alkalis, and aliphatic solvents after full curing.

Typical Applications Of YD-115E Epoxy Resin

  1. Electrical encapsulation and potting of transformers, inductors, and power modules.

  2. Structural adhesive formulations for aerospace and automotive composites.

  3. Matrix resin for filament-wound pressure vessels and carbon fiber reinforced laminates.

  4. Base resin in high-performance printed circuit board (PCB) prepregs and bonding films.

  5. Coating systems for corrosion protection of offshore and industrial steel structures.

Specifications Of YD-115E Epoxy Resin

Chemical TypeBisphenol-A diglycidyl ether (DGEBA)
Product FormClear, low-viscosity liquid
AppearancePale yellow to water-white, transparent
Epoxy Equivalent Weight (EEW)186–192 g/eq
Viscosity (25°C)12,000–14,000 cP
Chloride Content≤ 800 ppm
Softening PointNot applicable (liquid at room temperature)
Storage Stability12 months at ≤ 25°C in sealed containers


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *