High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent adhesion to metals, glass, and composite substrates under ambient and elevated cure conditions.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss at high frequencies.
Good chemical resistance to dilute acids, alkalis, and aliphatic solvents after full curing.
Electrical encapsulation and potting of transformers, inductors, and power modules.
Structural adhesive formulations for aerospace and automotive composites.
Matrix resin for filament-wound pressure vessels and carbon fiber reinforced laminates.
Base resin in high-performance printed circuit board (PCB) prepregs and bonding films.
Coating systems for corrosion protection of offshore and industrial steel structures.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 186–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China