High reactivity with amine and anhydride hardeners, enabling rapid cure at ambient or elevated temperatures.
Excellent chemical resistance to alkalis, dilute acids, and solvents after full curing.
Superior adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) for easy processing, impregnation, and air-release during casting or molding.
Good electrical insulation properties with high dielectric strength and volume resistivity.
Electrical encapsulation and potting of transformers, sensors, and power modules.
Structural adhesive formulations for aerospace composite bonding and automotive lightweight assemblies.
High-performance coating systems for corrosion protection of offshore and industrial steel structures.
Matrix resin in filament-wound pressure vessels and fiber-reinforced polymer (FRP) tanks.
Underfill and conformal coating materials for advanced electronics packaging.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | ≤ 800 ppm (total chlorine) |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China