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Highly reactive liquid epoxy resin with low viscosity for excellent processability and filler wetting.
Optimized molecular weight distribution delivering balanced mechanical strength and thermal stability.
Low chloride content ensuring superior electrical insulation properties and corrosion resistance.
Consistent batch-to-batch quality meeting stringent industrial manufacturing requirements.
Compatible with standard amine, anhydride, and phenolic curing agents for versatile formulation design.
Electrical encapsulation and potting compounds for power electronics and transformers.
High-performance laminating resins in printed circuit board (PCB) prepreg and copper-clad laminates.
Structural adhesives requiring high bond strength and thermal endurance.
Composite matrices for aerospace and automotive components demanding dimensional stability.
Insulating coatings and varnishes for motor windings and electrical machinery.
| Chemical Type | Bisphenol A-based diglycidyl ether epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Epoxide Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Color (Gardner) | ≤ 3 |
| Volatiles Content | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
