Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

MY0500 Epoxy Resin

MY0500EpoxyResinbyMitsuiChemicals’MYseriesisanadvancedbiphenyl-typediglycidyletherresinofferingexceptionalheatresistance,lowdielectricloss,andhighdimensionalstabilityidealfor5Gsubstrates,ICpackaging,andhigh-performancecomposites.
  • my0500 epoxy resin_5f071035
  • my0500 epoxy resin_5f071035

Features Of MY0500 Epoxy Resin

  1. High reactivity with standard amine and anhydride hardeners for rapid gelation and short cure cycles.

  2. Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.

  3. Low viscosity (12,000–14,000 cP at 25 °C) enabling easy mixing, degassing, and impregnation of fibrous reinforcements.

  4. Superior thermal stability with glass transition temperature (Tg) exceeding 125 °C after full cure.

  5. Low chloride content (< 100 ppm), ensuring compatibility with sensitive electronic encapsulation and aerospace bonding applications.

Typical Applications Of MY0500 Epoxy Resin

  1. Aerospace structural adhesives and composite matrix resins for secondary bonding and repair.

  2. High-performance electrical encapsulants and potting compounds for power electronics and transformers.

  3. Wind turbine blade bonding adhesives requiring fatigue resistance and environmental durability.

  4. Automotive under-hood components requiring thermal and chemical resistance.

  5. Industrial tooling and mold-making matrices for high-precision carbon fiber layup tools.

Specifications Of MY0500 Epoxy Resin

Chemical TypeBisphenol-F based liquid epoxy resin
Product FormClear to pale amber viscous liquid
AppearanceHomogeneous, free from gels or sediment
Epoxy Equivalent Weight (EEW)180–190 g/eq
Viscosity (25 °C)12,000–14,000 cP
Chloride Content< 100 ppm
Volatiles Content< 0.3 wt%
Storage Stability12 months at 20–25 °C in unopened original container


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