High reactivity with standard amine and anhydride hardeners for rapid gelation and short cure cycles.
Excellent adhesion to metals, composites, and cured polymer substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25 °C) enabling easy mixing, degassing, and impregnation of fibrous reinforcements.
Superior thermal stability with glass transition temperature (Tg) exceeding 125 °C after full cure.
Low chloride content (< 100 ppm), ensuring compatibility with sensitive electronic encapsulation and aerospace bonding applications.
Aerospace structural adhesives and composite matrix resins for secondary bonding and repair.
High-performance electrical encapsulants and potting compounds for power electronics and transformers.
Wind turbine blade bonding adhesives requiring fatigue resistance and environmental durability.
Automotive under-hood components requiring thermal and chemical resistance.
Industrial tooling and mold-making matrices for high-precision carbon fiber layup tools.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale amber viscous liquid |
| Appearance | Homogeneous, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 180–190 g/eq |
| Viscosity (25 °C) | 12,000–14,000 cP |
| Chloride Content | < 100 ppm |
| Volatiles Content | < 0.3 wt% |
| Storage Stability | 12 months at 20–25 °C in unopened original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China