High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing in casting, potting, and filament winding.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to weak acids, alkalis, and polar solvents after full cure.
Electrical insulation systems for medium-voltage transformers and bushings.
Potting and encapsulation of power electronics, IGBT modules, and EV battery management units.
Structural adhesive formulations for aerospace composite bonding and repair.
High-performance filament-wound pressure vessels and piping for industrial fluid handling.
Casting resins for precision tooling, jigs, and metrology fixtures requiring dimensional stability.
| Chemical Type | Bisphenol-F based diglycidyl ether epoxy resin |
| Product Form | Liquid |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 170–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Softening Point | Not applicable (liquid at room temperature) |
| Chloride Content | ≤ 500 ppm |
| Primary Applications | Electrical insulation, structural bonding, potting, filament winding |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China