High purity bisphenol-A based liquid epoxy resin with consistent epoxide equivalent weight (EEW).
Excellent adhesion to metals, glass, and composite substrates.
Low viscosity (< 12,000 cP at 25°C) enabling easy processing and improved filler dispersion.
Good thermal stability and chemical resistance after curing with standard amine or anhydride hardeners.
Low chloride content (< 800 ppm), supporting high electrical insulation performance.
Electrical encapsulation and potting compounds for transformers and sensors.
Structural adhesives in automotive and aerospace bonding assemblies.
Composite matrix resin for fiber-reinforced laminates and wind turbine blade components.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
Printed circuit board (PCB) laminates and prepreg formulations.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | Stable for 12 months at 20–25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China