High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and cured epoxy substrates without surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good thermal stability with glass transition temperature (Tg) of ~125°C after full cure with DDS.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Matrix resin for filament-wound composite pressure vessels and structural tanks.
Core material in laminated busbars and power electronics modules requiring thermal management.
Adhesive formulation for bonding dissimilar substrates in automotive and aerospace assemblies.
Base resin for high-performance casting compounds used in industrial tooling and precision molds.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 170–178 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | < 800 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, composites, adhesives, casting |
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E-mail: wangxingqiang@ericwchem.com
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