Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

DMP-30 Epoxy Resin Accelerator

DMP-30 Epoxy Resin Accelerator is a high-performance tertiary amine catalyst from the DMP series by Air Products, widely used to accelerate epoxy–amine curing at ambient or elevated temperatures. It enhances reactivity, improves pot life control, and ensures consistent crosslinking in composites, adhesives, and coatings without compromising final mechanical properties.
  • dmp 30 epoxy resin accelerator_d246f672
  • dmp 30 epoxy resin accelerator_d246f672

Features Of DMP-30 Epoxy Resin Accelerator

  1. Highly effective tertiary amine catalyst for rapid epoxy resin curing at ambient or elevated temperatures.

  2. Excellent compatibility with standard bisphenol-A and bisphenol-F epoxy resins, as well as novolac epoxies.

  3. Enables low-viscosity formulations with improved pot life control and predictable gel time response.

  4. Non-volatile liquid with low odor and favorable handling characteristics compared to solid accelerators.

  5. Supports high crosslink density and enhanced thermal/mechanical performance in cured networks.

Typical Applications Of DMP-30 Epoxy Resin Accelerator

  1. Electrical encapsulation and potting compounds for transformers, capacitors, and PCB protection.

  2. Structural adhesives used in aerospace, automotive, and rail bonding applications.

  3. High-performance flooring and coating systems requiring fast turnaround and chemical resistance.

  4. Fiber-reinforced polymer (FRP) composites and pultrusion resins.

  5. Repair mortars and anchoring grouts for construction and infrastructure maintenance.

Specifications Of DMP-30 Epoxy Resin Accelerator

Chemical TypeTertiary amine (1,3,5-tris(3-dimethylaminopropyl)hexahydro-s-triazine)
Product FormLiquid
AppearancePale yellow to amber clear liquid
Density (25°C)~1.04–1.06 g/cm³
Viscosity (25°C)~200–400 mPa·s
Amine Value~480–520 mg KOH/g
Primary ApplicationsEpoxy resin curing accelerator for coatings, adhesives, composites, and encapsulants
Key FeaturesRapid cure initiation, ambient-temperature reactivity, resin compatibility, low volatility


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