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High purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with common amine and anhydride curing agents.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing and impregnation.
Superior electrical insulation properties and thermal stability up to 130°C.
Consistent batch-to-batch quality meeting ISO 9001 manufacturing standards.
Electrical potting and encapsulation for transformers, reactors, and insulators.
High-voltage composite insulator housings and bushing matrices.
Structural adhesives in aerospace and wind turbine blade bonding.
Coating systems for corrosion-resistant linings in chemical storage tanks.
Prepregs and laminates for printed circuit board (PCB) substrates.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free of gel particles or sediment |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | ≤ 750 ppm |
| Softening Point | 12–16°C |
| Storage Stability | ≥ 12 months at 20–25°C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
