High molecular weight bisphenol-A based solid epoxy resin with excellent thermal stability.
Low chlorine content for improved electrical insulation and reduced corrosion risk in cured systems.
Consistent melt viscosity and narrow molecular weight distribution for reliable processing control.
Excellent compatibility with common amine and anhydride curing agents used in high-performance composites.
Good adhesion to metals, glass, and carbon fibers—ideal for structural bonding and encapsulation.
Aerospace composite prepregs and filament-wound structures.
Electrical and electronic encapsulation of transformers, insulators, and high-voltage components.
High-strength adhesive formulations for metal-to-metal and metal-to-composite bonding.
Wind turbine blade matrix resins requiring long-term durability and fatigue resistance.
Tooling and mold-making compounds for precision composite manufacturing.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Light tan to amber solid flakes or pellets |
| Appearance | Free-flowing granular solid at room temperature |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Melt Viscosity (at 175 °C) | 8,000–12,000 cP |
| Softening Point | 85–92 °C |
| Chlorine Content | ≤ 900 ppm |
| Volatiles (at 150 °C, 2 hrs) | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China