Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Hexion EPON 1001F Solid Epoxy Resin

Hexion EPON 1001F Solid Epoxy Resin is a high-purity, low-viscosity bisphenol-A-based epoxy resin offering excellent mechanical strength, chemical resistance, and adhesion. Widely used in composites, electrical encapsulation, and structural adhesives, it delivers consistent reactivity and superior thermal stability for demanding industrial applications.
  • hexion epon 1001f solid epoxy resin_79ccfe2c
  • hexion epon 1001f solid epoxy resin_79ccfe2c

Features Of Hexion EPON 1001F Solid Epoxy Resin

  1. High molecular weight bisphenol-A based solid epoxy resin with excellent thermal stability.

  2. Low chlorine content for improved electrical insulation and reduced corrosion risk in cured systems.

  3. Consistent melt viscosity and narrow molecular weight distribution for reliable processing control.

  4. Excellent compatibility with common amine and anhydride curing agents used in high-performance composites.

  5. Good adhesion to metals, glass, and carbon fibers—ideal for structural bonding and encapsulation.

Typical Applications Of Hexion EPON 1001F Solid Epoxy Resin

  1. Aerospace composite prepregs and filament-wound structures.

  2. Electrical and electronic encapsulation of transformers, insulators, and high-voltage components.

  3. High-strength adhesive formulations for metal-to-metal and metal-to-composite bonding.

  4. Wind turbine blade matrix resins requiring long-term durability and fatigue resistance.

  5. Tooling and mold-making compounds for precision composite manufacturing.

Specifications Of Hexion EPON 1001F Solid Epoxy Resin

Chemical TypeBisphenol-A based solid epoxy resin
Product FormLight tan to amber solid flakes or pellets
AppearanceFree-flowing granular solid at room temperature
Epoxy Equivalent Weight (EEW)475–495 g/eq
Melt Viscosity (at 175 °C)8,000–12,000 cP
Softening Point85–92 °C
Chlorine Content≤ 900 ppm
Volatiles (at 150 °C, 2 hrs)≤ 0.3 wt%


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